Principal Laser Packaging Engineer Location: San Francisco Bay Area, CA (Berkeley / Hybrid) Industry: Deep Tech / Photonics & Semiconductors Employment Type: Full-Time Compensation: $135,000 – $165,000 / year base salary + competitive equity package Position Overview We are seeking an experienced Principal Laser Packaging Engineer for a venture-backed deep tech startup developing and commercializing next-generation, high-power photonic crystal surface-emitting lasers (PCSELs). In this role, you will take full ownership of the laser module packaging architecture, guiding high-power laser dies from initial concept to a fully manufacturable, taped-out package. You will be directly responsible for the thermal architecture, die-attach and bonding strategy, and hardware integration to ensure devices meet rigorous wavelength, efficiency, and reliability specifications through assembly and characterization. Key Responsibilities Lead and own the complete laser package architecture from conceptual design through tape-out. Architect and optimize the thermal path, including die-attach, submount selection, heat-spreader design, and active/passive cooling integration. Translate target electro-optical performance metrics into a robust, manufacturable package that maintains emission wavelength stability and optical efficiency across dynamic operating conditions. Perform thermal and mechanical modeling/simulations and correlate results with empirical data (junction temperature, wavelength drift, and thermal rollover). Rapidly troubleshoot, debug, and iterate packaging solutions in an agile, high-growth startup environment. Candidate Qualifications Education: Bachelor’s or Master’s degree in Electrical Engineering, Materials Science, Physics, Mechanical Engineering, Optical Engineering, or a related field. Packaging Experience: Proven track record in optoelectronic or laser packaging, with specific hands-on experience packaging high-power continuous-wave (CW) semiconductor lasers. Full-Lifecycle Delivery: Demonstrated success bringing semiconductor laser dies from early concept to a taped-out, reliable, and manufacturable package. Thermal & Physics Acumen: Strong fundamental understanding of how thermo-mechanical dynamics influence semiconductor laser performance and device lifetime. Problem-Solving & Communication: Self-directed mindset comfortable with ambiguity in an early-stage startup environment, paired with strong technical writing and collaborative communication skills.

Erforderliche Kompetenzen

Laser package architecture designThermal architecture engineering for high-power lasers (die-attach, submount, heat-spreader)Die-attach and bonding process developmentActive and passive cooling system integrationDesign for manufacturability (DFM) and tape-out readiness for laser packagesThermal and mechanical modeling and simulation (e.g., FEM)Thermal characterization and empirical data correlation (junction temperature, wavelength drift, thermal rollover)Packaging of high-power continuous-wave (CW) semiconductor lasersFull-lifecycle product delivery from concept to taped-out semiconductor laser packageReliability engineering and testing for semiconductor laser modulesRapid prototyping, troubleshooting, and iterative debugging in a high-growth startupTechnical writing and collaborative cross-functional communicationSelf-directed work and ability to operate with ambiguity in an early-stage startup

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